Пикосекундные УФ-лазеры DPSS с воздушным охлаждением - Passat

В то время как высокая частота повторения импульсов обеспечивает более высокую производительность, высокая пиковая мощность лазерных импульсов необходима для резки различных материалов под более острым углом, что значительно снижает потери материала и увеличивает скорость резки.

Высокая пиковая мощность является одной из наиболее важных особенностей семейства пикосекундных лазеров Passat, особенно на коротких длинах волн УФ (266 нм, 213 нм).

На приведенной ниже диаграмме сравниваются пиковые мощности, создаваемые коммерчески доступными пикосекундными лазерами DPSS:

In particular, the high laser peak power is necessary for cutting transparent dielectrics (via cold ablation) with wide energy band gap such as diamond, sapphire, quartz and fused silica. This is so because, for high intensity laser beams two-photon absorption dominates over single-photon absorption, which is relatively low at wavelengths produced by most commercially available lasers. As a result, the ablation threshold drops, the ablation rate increases and the typical taper angle of cutting α becomes sharper, which increases the cutting depth. Sample cuts of different materials with different taper angle α are shown on the following page: Materials Processing

Our estimates, made for two-photon absorption, allow finding the cutting taper angle α which is determined by the following formula:

α ≈ λ/E1/2 x (ΘPD/γβτ)1/4 ,

where E is the laser pulse energy (in J), ΘPD is the energy characterizing photo-decomposition of dielectric by UV picosecond pulses (in J/cm3), β is the coefficient of two-photon absorption (in cm/W), γ is the portion of energy absorbed by the dielectric after deduction of radiative losses, while τ is the laser pulse width (in sec).

The angle α does not depend on pulse repetition rate and depends very slightly on the parameter (ΘPD/γβτ)1/4, characterizing the dielectric to be cut. But the dependence on the wavelength and pulse energy is rather strong. For example, for ΘPD = 10 kJ/cm3 , β = 4 cm/GW, γ = 0.5, τ = 5 ps, E = 100 μJ, λ = 266 nm, the angle α is equal to 6 mrad (or 0.350). Such an angle provides very low cutting losses. If anyone needs to cut a dielectric sphere half-and-half the losses will be about α/2, which for the example above corresponds to only 0.3%.

To cut material through the given thickness H, the volume of material removed will be proportional to α or ~~1/\sqrt{E}

Thus,

Even at the Same Average Power, Greater Pulse Energy Provides Faster Cutting.

DPSS lasers in the Compiler family enjoy the following technological benefits:

The highest pulse energy for the laser size, especially in the UV wavelength range, which reduces material losses.

High energy short picosecond pulses allow micro machining of thicker materials, such as drilling and cutting of glass, diamond, ceramics, metals, etc. up to few millimetres thick.

The most compact laser head sizes (per energy unit), lightweight and lower power consumption among comparable picosecond UV lasers.

Air Cooling.

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The video of 355nm 10W Ultra violet DPSS Laser Pulsed Laser System engraving jade

RFH Expert III 355 series high power UV laser, developed and produced by RFH, covers 10w-15w in laser power with short pulse width (<20ns@40K) ,superior beam quality (M²<1.2) and perfect laser spot quality (beam circularity >90%). It is widely used in PE/PCB/FPC cutting, glass & sapphire cutting, drilling, scribing & cutting used in high precision micromaching areas.