Reliable performance, which RFH lasers are used in mobile phone manufacturing

As the most commonly used carrier of mobile Internet, smartphones have been deeply integrated with people's clothing, food, housing and transportation. With the widespread application of 5G, it will even have a transformative impact on people's lives.

In addition to the continuous research and development of R&D and designers, the powerful functions of mobile phones are also inseparable from the support of advanced manufacturing processes. Among them, laser processing has obvious advantages in mobile phone manufacturing, and has gradually replaced many power transmission processing technologies. The industrial-grade nanosecond solid-state lasers and industrial-grade picosecond lasers developed and designed by RFH have the characteristics of high precision, fast speed, high stability, and environmental protection in laser marking, laser cutting, and laser drilling of mobile phone manufacturing.

The application of laser marking in the production of smart phones is mainly manifested in LOGO marking, mobile phone casings, mobile phone batteries, motherboards, IC chip surfaces, etc., as well as accessories such as data cables, Bluetooth wireless headset casings, charging heads, etc. The principle is to use high energy. The dense laser beam acts on the surface of the material, and a photochemical reaction of color change occurs through the evaporation or vaporization of the surface material, thereby marking a permanent mark. RFH's industrial-grade nanosecond solid-state laser can be selected here. The 355nm ultraviolet laser output by it has high load energy, and with a narrow pulse width of less than 25ns, it can break the molecular bonds of the material and has a smaller thermal effect. It belongs to cold light processing. This cold working has a special significance in laser marking, which means that there will be no deformation, scorching, yellowing and other phenomena during the marking process; its excellent beam quality M2<1.2, and the focused spot diameter is very small, only It is micron level. This precision enables marking on very small material surfaces during the marking process. On the other hand, the marking effect is more precise and clear, and various characters and symbols can be printed. And patterns, etc., which is also of great significance to the anti-counterfeiting of products.

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Laser cutting is more used for mobile phone screen cutting/digging, screen outer glass cutting, camera sapphire protective lens laser cutting, rear glass cover cutting, motherboard cutting, FPC flexible circuit board cutting, etc. These manufacturing links are especially suitable for Nanofei Optoelectronics industrial-grade picosecond lasers to exert their excellent performance. When cutting materials, it has a short pulse width of close to 10ps and has a very high peak power. It can inject energy into a small area of ​​action very quickly, avoiding laser linear absorption, energy diffusion and transfer, and there is no heat-affected zone during processing. It belongs to cold processing. With the appropriate cutting process, it can be formed at one time, eliminating the need for other processes in the later stage, and without the limitation of processing materials, and the processing efficiency is greatly improved. The beam quality M2<1.3, the energy is highly concentrated, and the focused spot is micron, which can bring fine cutting effect.

Лазерное сверление обычно используется при групповом сверлении микроотверстий в сетке мобильных телефонов, сверлении антенн, микросверлении печатных плат и т. д. Использование пикосекундного лазера промышленного класса RFH для пробивки отверстий отличается высокой эффективностью, низкой стоимостью, отсутствием деформации и подходящими материалами. . Широкий ассортимент и так далее.

В дополнение к лазерной маркировке, лазерной резке, лазерному сверлению и другим применениям, эти два лазера RFH также могут использоваться в лазерном прямом формовании LDS, лазерном травлении и других процессах в производстве мобильных телефонов. С развитием новых материалов и технологий для мобильных телефонов, а также некоторыми индивидуальными потребностями предъявляются более высокие требования к технологии обработки в процессе производства смартфонов, и технология лазерной обработки также получит более широкие перспективы применения. В соответствии с передовыми приложениями были разработаны и спроектированы более совершенные, стабильные и надежные лазеры, позволяющие обновлять и итерировать смартфоны.