What is the difference between a picosecond laser cutting machine and a nanosecond laser cutting machine

 In recent years, as the demand for industrial technology continues to increase, the requirements for processing tools have become higher and higher. The development direction of micro-precision laser cutting tools is also approaching market demand, and the development of ultrafast lasers has gradually formed Nanosecond laser cutting takes the lead, and the development of picosecond laser cutting machine and femtosecond laser cutting machine is suitable for market demand.

The laser processing method is to use a high-energy laser beam

 Nanoseconds, picoseconds, and femtoseconds are time units, 1 second=103 milliseconds=106 microseconds=109 nanoseconds=1012 picoseconds=1015 femtosecond, picosecond laser cutting machine, nanosecond laser cutting machine refers to the laser The action time of a single pulse within the time range of picoseconds and nanoseconds refers to the pulse width of the laser. The laser processing method is to use a high-energy laser beam to irradiate the surface of the material after focusing to cause a physical or chemical reaction to form a cut. It is essentially a thermal processing method, but due to the short action time, usually within a few nanoseconds Within the range, so the heat-affected area is small, which can ensure the processing effect and processing speed.

Thermal effects in the nanosecond laser range are amplified

 In today’s mainstream market, our common laser processing tool is a nanosecond laser, and as the requirements of industrial technology not only increase, the thermal effect in the nanosecond laser range is amplified, and the resulting defects caused by the thermal effect The effect is not accepted by the market. A new laser processing tool came into being. It meets market demand and is also a technological breakthrough in the laser industry. In the industry, we call it micro-precision ultra-fast laser processing system, which is usually called leather. Second laser cutting machine or femtosecond laser cutting machine.

Micro-precision laser processing field

The picosecond laser cutting machine has an ultra-short pulse time, and the action time of a single pulse is only a few picoseconds, so its thermal effect is very small, or even negligible. Compared with the processing of a nanosecond laser cutting machine, there is no recast material in the entire processing process, the processing process is clean, and the absorption of laser energy is less dependent on the material or wavelength. Therefore, in the field of micro-precision laser processing, the picosecond laser cutting machine and femtosecond laser cutting machine of the ultra-fast laser processing system provide a broad space for development, and its processing characteristics are destined to be an important position in the future.

laser cutter

Compared with the nanosecond laser, the picosecond laser cutting machine has better processing effect and processing speed. In the market application field, the picosecond laser also has a wider space, such as solar cell laser etching (narrower line width), OLED laser Cutting (smaller chipping), laser drilling of brittle materials (faster speed), etc., can do things that cannot be done in the nanosecond time range, mainly due to the influence of the heat-affected zone. From the figure below, we can Intuitively see the difference between ultrafast picosecond laser and nanosecond laser. In the figure, we find that the thermal impact area and thermal impact of the material in the nanosecond range, while the ultra-fast picosecond laser cutting machine has almost negligible thermal impact, so the processing effect is more ideal. At the same time, the action time is short, the accuracy is higher, and the processing speed is faster.

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В чем разница между пикосекундной лазерной резкой и наносекундной лазерной резкой?

 Именно благодаря характеристикам сверхбыстрой пикосекундной лазерной резки с низким уровнем нагрева, холодной абляции и высокой точностью, он обладает исключительными характеристиками при обработке нержавеющей стали, алюминия, титанового сплава, сапфира, керамики, стекла и других материалов и широко используется. в научных исследованиях, биологических приборах, солнечной фотогальванике, производстве электронных продуктов, производстве полупроводников и других областях имеют абсолютный статус любимца.

Конечно, на основном рынке лазерной обработки в настоящее время доминируют наносекундные лазеры. Причина в том, что стоимость пикосекундных сверхбыстрых лазерных станков для резки высока. Будущая тенденция должна быть в области пикосекунд и фемтосекунд. Будущее можно ожидать