High-power UV laser light source marking mobile phone IC chips

The traditional marking method of IC chips is ink printing. With the continuous expansion of the market and the increasingly fierce competition, users have higher and higher requirements for the marking of IC strips, and the corresponding marking equipment ---- printing machine has been further improved. requirements. With the popularization of more efficient printing methods such as laser printing and pad printing, topsunlaser.com, a fully automatic laser marking equipment with automatic loading and unloading functions, has become the final choice for post-packaging lines.

Mobile phone chip is a classification of IC, which is a circuit module that integrates various electronic components on a silicon board to achieve a specific function. It is the most important part of electronic equipment, which undertakes the functions of computing and storage. A chip is the carrier of an integrated circuit, which is divided by multiple wafers, and is a general term for semiconductor components. A small chip, rich in infinite information.

Mobile phone IC chip laser marking

For identification or other functions on the surface of the chip, there will always be some patterns and numbers, and the chip is characterized by small size and high integration density, so the precision requirements in the process of marking the chip surface are very high. Under the premise of damage to components, clear text, model, manufacturer and other information are marked.

Технология лазерной маркировки — это технология, в которой используется тепловой эффект лазера для абляции поверхностного материала объекта, чтобы оставить неизгладимую метку. По сравнению с традиционными электрохимическими, шелкографическими, механическими и другими методами маркировки, он отличается отсутствием загрязнения, высокой скоростью, высоким качеством и большой гибкостью. , не касается заготовки и другие преимущества. Автоматическая система лазерной маркировки представляет собой комплексное применение современных лазерных, компьютерных, электрических систем управления, механического проектирования и других оптико-механических технологий.